PANews reported on March 18th that Nvidia will host the top global AI summit GTC2025 from March 17th to 21st local time in the United States. Jensen Huang will deliver a keynote speech focusing on the future development of AI intelligent agents, robotics technology, and accelerated computing. The conference will concentrate on the iteration of AI Computing Power, highlighting the next generation Blackwell Ultra GPU and Vera Rubin super chip architecture. According to official sources, the conference will unveil several technological innovations, including the new generation GB300 and B300 Computing Power cards, CPO switches, and NVL288 cabinet solutions. The performance of B300 may exceed that of B200 by more than 50%.
With the rapid development of AI technology, the demand for Computing Power continues to rise. In order to meet the growing demand for Computing Power, hardware devices are continuously being iteratively upgraded, which also brings huge business opportunities to the new materials field. Especially in the iterative process of AI Computing Power, the demand for high-performance, high-stability materials is becoming increasingly urgent, with PTFE (polytetrafluoroethylene) materials becoming a core innovation point due to their advantages in high-frequency transmission performance. It is reported that in the next generation GB300 AI servers and NVL72 architecture from NVIDIA, PTFE-based multilayer PCBs (more than 40 layers) are used for orthogonal backplane design, replacing traditional copper cable solutions. It is estimated that by 2025, the global demand for PTFE resin in AI servers will exceed 10,000 tons, with a market size of billions of dollars.
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NVIDIA GTC conference is about to be held, focusing on AI Computing Power iteration
PANews reported on March 18th that Nvidia will host the top global AI summit GTC2025 from March 17th to 21st local time in the United States. Jensen Huang will deliver a keynote speech focusing on the future development of AI intelligent agents, robotics technology, and accelerated computing. The conference will concentrate on the iteration of AI Computing Power, highlighting the next generation Blackwell Ultra GPU and Vera Rubin super chip architecture. According to official sources, the conference will unveil several technological innovations, including the new generation GB300 and B300 Computing Power cards, CPO switches, and NVL288 cabinet solutions. The performance of B300 may exceed that of B200 by more than 50%. With the rapid development of AI technology, the demand for Computing Power continues to rise. In order to meet the growing demand for Computing Power, hardware devices are continuously being iteratively upgraded, which also brings huge business opportunities to the new materials field. Especially in the iterative process of AI Computing Power, the demand for high-performance, high-stability materials is becoming increasingly urgent, with PTFE (polytetrafluoroethylene) materials becoming a core innovation point due to their advantages in high-frequency transmission performance. It is reported that in the next generation GB300 AI servers and NVL72 architecture from NVIDIA, PTFE-based multilayer PCBs (more than 40 layers) are used for orthogonal backplane design, replacing traditional copper cable solutions. It is estimated that by 2025, the global demand for PTFE resin in AI servers will exceed 10,000 tons, with a market size of billions of dollars.